Track Chairs

Track 1: Emerging Materials

Track 1: Emerging Materials

Univ. Manchester, UK

Track 2: Advanced manufacturing of printed and flexible electronics

Track 2: Advanced manufacturing

University of California San Diego, USA

Track 2: Advanced manufacturing

Centre for Process Innovation, UK

Track 3: Physical Sensors and Smart Systems

Track 3: Physical Sensors and Smart Systems

Silicon Austria Labs GmbH, Austria

Track 3: Physical Sensors and Smart Systems

National University, Singapore

Track 4: Bio- and Chemical Sensors

Track 4: Bio- and Chemical Sensors

Åbo Akademi University, Finland

Track 4: Bio- and Chemical Sensors

California Institute of Technology, USA

Track 5: Energy harvesting and Storage

Track 5: Energy harvesting and Storage

VTT TECHNICAL RESEARCH CENTRE OF FINLAND

Track 6: Green and Low-Power Electronics

Track 7: Hybrid Integrated Systems, Thin chips and Packaging

Track 7: Hybrid Integrated Systems, Thin chips and Packaging

ARM, UK

Track 7: Hybrid Integrated Systems, Thin chips and Packaging

IMEC and KU Leuven, Belgium

Track 8: Reliability, Simulation and modelling

Track 8: Reliability, Simulation and modelling

Western Michigan University, USA

Track 8: Reliability, Simulation and modelling

Indian Institute of Science, Bangalore, India

Track 9: Printed Smart Tags and Communication Devices

Track 9: Printed Smart Tags and Communication Devices

Department of Electrical and Computer Engineering, Aarhus University, Denmar

Track 9: Printed Smart Tags and Communication Devices

University of Roma Tor Vergata, Italy

Track 10: Emerging Applications

Track 10: Emerging Applications

University of Texas, Austin, USA

Track 10: Emerging Applications

NOVA School of Science and Technology (FCT-NOVA)

Special Thanks

Conference Sponsors

Exhibitors

Award Patrons

Cambridge University Press
  • 00Days Until the Conference

Contact Us

IEEE websites place cookies on your device to give you the best user experience. By using our websites, you agree to the placement of these cookies. To learn more, read our Privacy Policy.