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Track Chairs

Track 1: Emerging Materials

Track 1: Emerging Materials

Univ. Manchester, UK

Track 2: Advanced manufacturing of printed and flexible electronics

Track 2: Advanced manufacturing

University of California San Diego, USA

Track 2: Advanced manufacturing

Centre for Process Innovation, UK

Track 3: Physical Sensors and Smart Systems

Track 3: Physical Sensors and Smart Systems

Silicon Austria Labs GmbH, Austria

Track 3: Physical Sensors and Smart Systems

National University, Singapore

Track 4: Bio- and Chemical Sensors

Track 4: Bio- and Chemical Sensors

Åbo Akademi University, Finland

Track 4: Bio- and Chemical Sensors

California Institute of Technology, USA

Track 5: Energy harvesting and Storage

Track 5: Energy harvesting and Storage

VTT TECHNICAL RESEARCH CENTRE OF FINLAND

Track 6: Green and Low-Power Electronics

Track 7: Hybrid Integrated Systems, Thin chips and Packaging

Track 7: Hybrid Integrated Systems, Thin chips and Packaging

ARM, UK

Track 7: Hybrid Integrated Systems, Thin chips and Packaging

IMEC and KU Leuven, Belgium

Track 8: Reliability, Simulation and modelling

Track 8: Reliability, Simulation and modelling

Western Michigan University, USA

Track 8: Reliability, Simulation and modelling

Indian Institute of Science, Bangalore, India

Track 9: Printed Smart Tags and Communication Devices

Track 9: Printed Smart Tags and Communication Devices

Department of Electrical and Computer Engineering, Aarhus University, Denmar

Track 9: Printed Smart Tags and Communication Devices

University of Roma Tor Vergata, Italy

Track 10: Emerging Applications

Track 10: Emerging Applications

University of Texas, Austin, USA

Track 10: Emerging Applications

NOVA School of Science and Technology (FCT-NOVA)

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