About FLEPS

About FLEPS 2022

In recent years, material printing on flexible and disposable substrates has received substantial interest for realizing low cost, large-area electronics and sensing systems. As a result, new methods such as printing and additive manufacturing, etc. have also received significant attention to develop a wide range of easily deployable systems such as displays, sensors and RFID tags. The technologies developed for silicon based planar electronics and solid-state sensors is also being re-purposed to meet the demands in the emerging field of flexible and printed sensors. 

This trend will continue as all market indicators point towards significant growth in this area. Given the exponential growth seen in the flexible, printed and disposable sensor technology, the development of novel printable and solution processable nanomaterials, and the development of novel printing techniques that have brought about a new wave of novel printed sensor technologies and applications, the IEEE FLEPS offers an excellent forum to discuss latest developments in the field as well as understand the future roadmap.

Special Thanks

Conference Sponsors

  • 00Days Until the Conference

Contact Us

IEEE websites place cookies on your device to give you the best user experience. By using our websites, you agree to the placement of these cookies. To learn more, read our Privacy Policy.