The organizing committee of IEEE FLEPS 2022 is strongly committed to organizing the conference at the planned dates. We will be prepared for a full on-site presence in Vienna, with the possibility of having online presentations for authors who might not be able to travel. If you have any questions or concerns, please reach out to firstname.lastname@example.org
IEEE FLEPS 2022 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.
Presented papers will be included in the Proceedings of IEEE FLEPS 2022 and in IEEE Xplore pending author requirements being met. IEEE FLEPS 2022 will utilize IEEE Open Preview, which will allow conference proceedings to be available one month prior to the conference. Authors may submit an extended IEEE FLEPS 2022 papers to the Special Journal Issue in the
IEEE FLEX Journal.
The Conference exhibit area will provide your company or organization with the opportunity to inform and display your latest products, services, equipment, books, journals, and publications to attendees from around the world.
For further information, contact Coral Miller at Conference Catalysts, LLC.