Thank you for attending IEEE FLEPS 2022!

Mark Your Calendars

Important Dates

January 14, 2022

Tutorial & Focused Session Proposal Submission Deadline

January 21, 2022

Tutorial & Focused Session Proposal Submission Acceptance

February 25, 2022

Initial Paper Submission Deadline Extended

March 6, 2022

Initial Focus Paper Submission Deadline Extended

March 31, 2022

Notification of Acceptance

April 10, 2022

Final Manuscript Submission Deadline

June 10, 2022

Open Preview Publication Accessible Through IEEE Xplore

June 14, 2022

Standard Registration Deadline


The organizing committee of IEEE FLEPS 2022 is strongly committed to organizing the conference at the planned dates. We will be prepared for a full on-site presence in Vienna, with the possibility of having online presentations for authors who might not be able to travel.  If you have any questions or concerns, please reach out to

Call for Papers

The IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2022) will be held in Vienna, Austria.

IEEE FLEPS 2022 is intended to provide a forum for research scientists, engineers, and  practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

Topics of Interest

  • Organic/Inorganic Electronic Sensors
  • Emerging Materials for Flexible and Printable Systems
  • Manufacturing Techniques
  • High-throughput Printable Electronics
  • Hybrid Flexible Sensors and Electronics
  • Stretchable/Shrinkable Sensors and Electronics
  • Soft/Smart Wearable and Implantable Sensing Systems
  • Disposable/Reusable Sensors and Electronics
  • Printed Large-Area Sensors and Systems
  • Flexible or Printed Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.)
  • Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
  • Simulation and Modelling
  • Flexible/Printable Electronics in context with Circular Economy and green electronics

Focus Session Topics

  • Printed Biosensors for Point-of-Care Diagnostics
  • Brain-Inspired Computing
  • E-Textile Sensor Systems
  • Micro- and Nano-System TCAD
  • Printed Electronics for Automotives
  • E-Waste and Climate Change
  • Sensors Council Young Professionals 

Publication of Papers

Presented papers will be included in the Proceedings of IEEE FLEPS 2022 and in IEEE Xplore pending author requirements being met. IEEE FLEPS 2022 will utilize IEEE Open Preview, which will allow conference proceedings to be available one month prior to the conference. Authors may submit an extended IEEE FLEPS 2022 papers to the Special Journal Issue in the
IEEE FLEX Journal.

Exhibition & Patron Opportunities

The Conference exhibit area will provide your company or organization with the opportunity to inform and display your latest products, services, equipment, books, journals, and publications to attendees from around the world.

For further information, contact Coral Miller at Conference Catalysts, LLC.

Special Thanks

Conference Sponsors


Award Patrons

Cambridge University Press
  • 00Days Until the Conference

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